PIC16C64A/JW View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16C64A/JW Datasheet PDF : 108 Pages
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PIC16C62X
Package Type: K04-072 20-Lead Plastic Shrink Small Outine (SS) – 5.30 mm
E1
E
p
D
B
2
n
1
α
L
R2
c
A
A1
R1
φ
L1
A2
β
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
p
0.026
0.65
Number of Pins
n
20
20
Overall Pack. Height
A
0.068
0.073
0.078
1.73
1.86
1.99
Shoulder Height
A1
0.026
0.036
0.046
0.66
0.91
1.17
Standoff
A2
Molded Package Length D‡
Molded Package Width
E‡
0.002
0.005
0.008
0.05
0.13
0.21
0.278
0.283
0.289
7.07
7.20
7.33
0.205
0.208
0.212
5.20
5.29
5.38
Outside Dimension
E1
0.301
0.306
0.311
7.65
7.78
7.90
Shoulder Radius
R1
0.005
0.005
0.010
0.13
0.13
0.25
Gull Wing Radius
R2
0.005
0.005
0.010
0.13
0.13
0.25
Foot Length
L
0.015
0.020
0.025
0.38
0.51
0.64
Foot Angle
φ
0
4
8
0
4
8
Radius Centerline
L1
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
Lower Lead Width
B†
0.005
0.007
0.009
0.13
0.18
0.22
0.010
0.012
0.015
0.25
0.32
0.38
Mold Draft Angle Top
α
0
5
10
0
5
10
Mold Draft Angle Bottom β
0
5
10
0
5
10
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS30235G-page 98
Preliminary
© 1998 Microchip Technology Inc.
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