STA335BWS View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STA335BWS

2.1 channels high efficiency digital audio system

STMicroelectronics 

Package thermal characteristics

8

Package thermal characteristics

STA335BWS

Using a triple-layer PCB the thermal resistance (junction to ambient) with a center copper

ground area of 3 x 3 cm2 and with 16 via holes (see Figure 20) is 24° C/W in natural air

convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

The max estimated dissipated power for the STA335BWS is:

2 x 20 W @ 8 Ω, 18 V

Pd max ~ 4 W

2 x 10 W + 1 x 20 W @ 4 Ω, 8 Ω, 18 V Pd max < 5 W

Figure 20. Triple-layer PCB with copper ground area and 16 via holes

Figure 21 shows the power derating curves for the PowerSSO-36 package on a board with

two different sizes of copper layers.

Figure 21. PowerSSO-36 power derating curve

Pd (W) 8

7

6

5

4

3

2

1

0

0

Copper Area 3x3 cm

and via holes

Copper Area 2x2 cm

and via holes

SSTTAA333355BBWWS

PPoSwSeOrS3S6O-36

20 40 60 80 100 120 140 160

Tamb ( °C)

64/68

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