STA335BWS View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STA335BWS Datasheet PDF : 68 Pages
| |||
STA335BWS
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 22. PowerSSO-36 (slug-up) mechanical data and package dimensions
DIM.
A
A2
a1
b
c
D (1)
E (1)
e
e3
F
G
G1
H
h
k
L
M
N
O
Q
S
T
U
X
Y
MIN.
2.15
2.15
0
0.18
0.23
10.10
7.4
10.10
0.55
4.1
6.5
mm
TYP.
0.5
8.5
2.3
5˚
4.3
1.2
0.8
2.9
3.65
1.0
MAX.
2.47
2.40
0.075
0.36
0.32
10.50
7.6
0.10
0.06
10.50
0.40
0.90
10˚
4.7
7.3
MIN.
0.084
0.084
0
0.007
0.009
0.398
0.291
0.398
0.022
0.161
0.256
inch
TYP.
0.019
0.335
0.090
5˚
0.169
0.047
0.031
0.114
0.144
0.039
MAX.
0.097
0.094
0.003
0.014
0.012
0.413
0.299
0.004
0.002
0.413
0.016
0.035
10˚
0.185
0.287
(1) "D” and “E" do not include mold flash or protrusions Mold flash
or protrusions shall not exceed 0.15 mm per side(0.006”)
OUTLINE AND
MECHANICAL DATA
PowerSSO-36
(slug-down)
G
LEAD COPLANARITY
A
D
e
T
O
U
B
0.1 M A B
b
e3
hx45û
Y
M
L
BOTTOM VIEW
7587131 A
65/68
Share Link: 