TS2007FC
5
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 47. 9-bump flip-chip pinout (top view)
3
OUT-
GND
2
GS
VCC
1
IN+
VCC
OUT+
STBY
IN-
AB C
Balls are underneath
Figure 48. Marking (top view)
E
K7 X
YWW
● Logo: ST
● First two digits for part number: K7
● Third digit for assembly plant: X
● Three digit date code: YWW
● Dot indicates pin A1
● E symbol for lead free
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