TS2007FC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS2007FC

3 W filter-free class D audio power amplifier with 6 or 12 dB fixed gain select

STMicroelectronics 

Package information

TS2007FC

Figure 49. 9-bump flip-chip package mechanical data

1.57 mm

● Die size: 1.57 mm x 1.57 mm ±30 µm

● Die height (including bumps): 600 µm

● Bump diameter: 315 µm ±50 µm

1.57 mm ● Bump diameter before reflow: 300 µm ±10 µm

0.5mm

● Bump height: 250 µm ±40 µm

● Die height: 350 µm ±20 µm

● Pitch: 500 µm ±50 µm

0.5mm

∅ 0.25mm

● Back coating layer height*: 40 µm ±10 µm

● Coplanarity: 50 µm max

40µm

* Optional

600µm

26/28

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