STPS1L40 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS1L40 Datasheet PDF : 11 Pages
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Characteristics
STPS1L40
Figure 7.
Non repetitive surge peak forward Figure 8.
current versus overload duration
(maximum values, SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
7 IM(A)
6
5
4
3
2
IM
1
0
1.E-04
t
δ = 0.5
1.E-03
t(s)
1.E-02
SMA
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
1.E-01
1.E+00
7 IM(A)
6
5
4
3
2
IM
1
0
1.E-04
t
δ = 0.5
1.E-03
1.E-02
SMB
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
1.E-01
1.E+00
Figure 9.
Non repetitive surge peak forward Figure 10. Relative variation of thermal
current versus overload duration
impedance junction to ambient
(maximum values, STmite flat)
versus pulse duration (SMA)
16 IM(A)
14
12
10
8
6
4
IM
2
0
1.E-04
t
δ = 0.5
1.E-03
t(s)
1.E-02
STmite flat
Tc = 25 °C
Tc = 75 °C
Tc = 125 °C
1.E-01
1.E+00
Zth(j-a)/Rth(j-a)
1.0
0.9
SMA
Epoxy printed circuit board,
0.8
copper thickness = 35 µm,
0.7 recommended pad layout
0.6
0.5
0.4
0.3
0.2
0.1 Single pulse
0.0
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02
1.E+03
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
1.0 Zth(j-a)/Rth(j-a)
0.9
SMB
0.8
Epoxy printed circuit board,
copper thickness = 35 µm,
0.7
recommended pad layout
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02
1.E+03
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
Zth(j-a)/Rth(j-a)
1.0
STmite flat
0.9
Epoxy printed circuit board,
0.8 copper thickness = 35 µm,
0.7 recommended pad layout
0.6
0.5
0.4
0.3
0.2 Single pulse
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02
1.E+03
4/11
Doc ID 5507 Rev 6
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