STPS1L40 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS1L40 Datasheet PDF : 11 Pages
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Characteristics
STPS1L40
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
140 Rth(j-a)(°C/W)
Epoxy printed circuit board, FR4
120
copper thickness = 35 µm
100
SMA
80
60
40
20
Scu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
120 Rth(j-a)(°C/W)
Epoxy printed circuit board, FR4
100
copper thickness = 35 µm
SMB
80
60
40
20
0
Scu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
250 Rth(j-a)(°C/W)
225
Epoxy printed circuit board, FR4
copper thickness = 35 µm
200
STmite flat
175
150
125
100
75
50
25
Scu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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Doc ID 5507 Rev 6
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