STM8S007C8T6TR(2015) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM8S007C8T6TR
(Rev.:2015)

Value line, 24 MHz STM8S 8-bit MCU, 64 Kbytes Flash, true data EEPROM, 10-bit ADC, timers, 2 UARTs, SPI, I²C

STMicroelectronics 

Package information

STM8S007C8

10.2

10.2.1

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 16: General operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x JA)

Where:

 TAmax is the maximum ambient temperature in C

 JA is the package junction-to-ambient thermal resistance in C/W

 PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

 PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

 PI/Omax represents the maximum power dissipation on output pins, where:

PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

Table 50. Thermal characteristics(1)

Symbol

Parameter

Value

Unit

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm

57

JA

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

°C/W

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

86/92

DocID022171 Rev 5

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