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STP16N50M2(2018) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STP16N50M2 Datasheet PDF : 24 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STD16N50M2, STF16N50M2, STP16N50M2
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Parameter
DPAK
VGS
Gate-source voltage
ID
Drain current (continuous) at TC = 25 °C
ID
Drain current (continuous) at TC= 100 °C
IDM (1)
Drain current (pulsed)
PTOT
Total power dissipation at TC = 25 °C
dv/dt (2)
Peak diode recovery voltage slope
dv/dt (3)
MOSFET dv/dt ruggedness
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink (t = 1 s,
TC = 25 °C)
Tstg
Storage temperature range
Tj
Operating junction temperature range
1. Pulse width is limited by safe operating area.
2. ISD ≤ 13 A, di/dt ≤ 400 A/µs, VDS peak < V(BR)DSS, VDD = 80% V(BR)DSS
3. VDS ≤ 400 V
Value
TO-220
±25
13
8
52
110
15
50
-55 to 150
TO-220FP
25
2500
Unit
V
A
A
A
W
V/ns
V/ns
V
°C
Table 2. Thermal data
Symbol
Parameter
Rthj-case
Thermal resistance junction-case
Rthj-amb
Thermal resistance junction-ambient
Rthj-pcb (1)
Thermal resistance junction-pcb
1. When mounted on 1 inch² FR-4, 2 Oz copper board.
Value
DPAK
TO-220
TO-220FP
1.14
5
62.5
50
Unit
°C/W
Symbol
IAR
EAS
Table 3. Avalanche characteristics
Parameter
Avalanche current, repetitive or non-repetitive (pulse width limited by Tjmax)
Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V)
Value Unit
4
A
215 mJ
DS10450 - Rev 6
page 2/24

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