STPS61170CW View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS61170CW Datasheet PDF : 7 Pages
| |||
STPS61170C
2
Package information
Package information
● Epoxy meets UL94,V0
● Cooling method: by conduction (C)
● Recommended torque value: 0.55 to 1.0 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. TO-247 dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Max.
S
D
L1
L
E
∅R
L2
b1
b2
123 b
e
A
Heat-sink plane
∅P
c
3 21
A1
BACK VIEW
A
A1
b
b1
b2
c
D(1)
E
e
L
L1
L2
∅P(2)
∅R
S
4.85
5.15
2.20
2.60
1.00
1.40
2.00
2.40
3.00
3.40
0.40
0.80
19.85 20.15
15.45 15.75
5.45 typ.
14.20 14.80
3.70
4.30
18.50 typ.
3.55
3.65
4.50
5.50
5.50 typ.
1. Dimension D plus gate protrusion does not exceed 20.5 mm
2. Resin thickness around the mounting hole is not less than 0.9 mm
Min. Max.
0.191 0.203
0.086 0.102
0.039 0.055
0.078 0.094
0.118 0.133
0.015 0.031
0.781 0.793
0.608 0.620
0.215 typ.
0.559 0.582
0.145 0.169
0.728 typ.
0.139 0.143
0.177 0.217
0.216 typ.
Doc ID 11643 Rev 2
5/7
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