ST72361J4-AUTO View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72361J4-AUTO

8-bit MCU for automotive with Flash or ROM, 10-bit ADC, 5 timers, SPI, LINSCI™

STMicroelectronics 

ST72361xx-Auto

Package characteristics

20.3 Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to

ambient)

LQFP64

LQFP44

LQFP32

60

°C/W

52

70

PD

TJmax

Power dissipation(1)

Maximum junction temperature(2)

500

mW

150

°C

1. The maximum power dissipation is obtained from the formula PD = (TJ - TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD = PINT + PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the

application.

2. The maximum chip-junction temperature is based on technology characteristics.

20.4

Packaging for automatic handling

The devices can be supplied in trays or with tape and reel conditioning.

Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when

facing the tape sprocket holes as shown in Figure 127.

Figure 127. pin 1 orientation in tape and reel conditioning

Left orientation

Right orientation (EIA 481-C compliant)

Pin 1

Pin 1

See also Figure 128: ST72F361xx-Auto Flash commercial product structure on page 264

and Figure 129: ST72P361xxx-Auto FastROM commercial product structure on page 265.

Doc ID 12468 Rev 3

259/279

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