ST72324
13.2 THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance (junction to ambient)
TQFP44 10x10
TQFP32 7x7
SDIP42 600mil
SDIP32 200mil
Power dissipation 1)
Maximum junction temperature 2)
Value
52
70
55
50
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
147/161