ST72324J6TC 查看數據表（PDF） - STMicroelectronics
零件编号
产品描述 (功能)
生产厂家
ST72324J6TC
STMicroelectronics
ST72324J6TC Datasheet PDF : 161 Pages
| |||
ST72324
13.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only as design guidelines.
Figure 99. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
200
150
Temp. [°C]
100
50
80°C
PREHEATING
PHASE
5 sec
SOLDERING
PHASE
COOLING PHASE
(ROOM TEMPERATURE)
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 100. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=235+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
100
200
300
Time [sec]
400
Recommended glue for SMD plastic packages dedicated to molding compound with silicone:
s Heraeus: PD945, PD955
s Loctite: 3615, 3298
148/161
Share Link: 