PIC16LF870-I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LF870-I/SO Datasheet PDF : 156 Pages
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PIC16F870/871
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E
E1
p
D
B
2
n
1
α
A
c
A2
φ
A1
β
L
Units
INCHES
MILLIMETERS*
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
Pitch
p
28
.026
28
0.65
Overall Height
A
.068
.073
.078
1.73
1.85
Molded Package Thickness
A2
.064
.068
.072
1.63
1.73
Standoff
A1
.002
.006
.010
0.05
0.15
Overall Width
E
.299
.309
.319
7.59
7.85
Molded Package Width
E1
.201
.207
.212
5.11
5.25
Overall Length
D
.396
.402
.407
10.06
10.20
Foot Length
L
.022
.030
.037
0.56
0.75
Lead Thickness
Foot Angle
c
.004
.007
.010
0.10
0.18
φ
0
4
8
0.00
101.60
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.010
.013
.015
0.25
0.32
α
0
5
10
0
5
β
0
5
10
0
5
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
MAX
1.98
1.83
0.25
8.10
5.38
10.34
0.94
0.25
203.20
0.38
10
10
© 1999 Microchip Technology Inc.
Preliminary
DS30569A-page 139
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