ADSP-BF518KSWZ-ENG View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADSP-BF518KSWZ-ENG

Blackfin Embedded Processor

Analog Devices 

ADSP-BF512/BF514/BF516/BF518 (F)

OUTLINE DIMENSIONS

Dimensions in Figure 58 are shown in millimeters.

0.75

0.60

0.45

1.00 REF

1.60

MAX

176

1

26.20

26.00 SQ

25.80

PIN 1

Preliminary Technical Data

24.10

24.00 SQ

23.90

NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND

THERMALLY CONNECTED TO VSS. IMPLEMENT THIS BY

SOLDERING THE EXPOSED PAD TO A VSS PCB LAND THAT IS

THE SAME SIZE AS THE EXPOSED PAD. THE VSS PCB LAND

SHOULD BE ROBUSTLY CONNECTED TO THE VSS PLANE IN

THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST

PERFORMANCE.

133

133

176

132

132

1

1.45

1.40

1.35

0.15

0.10

0.05

12°

SEATING

PLANE

0.20

0.15

0.09

7°

0°

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

TOP VIEW

(PINS DOWN)

EXPOSED

PAD

5.80 REF

SQ

44

45

VIEW A

0.50

BSC

LEAD PITCH

89

88

89

88

0.27

0.22

0.17

COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD

Figure 58. 176-Lead Low Profile Quad Flat Package [LQFP_EP]

(SQ-176-2)

Dimensions shown in millimeters

BOTTOM VIEW

(PINS UP)

44

45

EXPOSED PAD IS CENTERED ON

THE PACKAGE.

Rev. PrE | Page 60 of 62 | March 2009

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