STM32WB35RGQ7TR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32WB35RGQ7TR

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

Electrical characteristics

STM32WB55xx STM32WB35xx

Caution:

I/O system current consumption

The current consumption of the I/O system has two components: static and dynamic.

I/O static current consumption

All the I/Os used as inputs with pull-up generate current consumption when the pin is

externally held low. The value of this current consumption can be simply computed by using

the pull-up/pull-down resistors values given in Table 72: I/O static characteristics.

For the output pins, any external pull-down or external load must also be considered to

estimate the current consumption.

Additional I/O current consumption is due to I/Os configured as inputs if an intermediate

voltage level is externally applied. This current consumption is caused by the input Schmitt

trigger circuits used to discriminate the input value. Unless this specific configuration is

required by the application, this supply current consumption can be avoided by configuring

these I/Os in analog mode. This is notably the case of ADC input pins which should be

configured as analog inputs.

Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,

as a result of external electromagnetic noise. To avoid current consumption related to

floating pins, they must either be configured in analog mode, or forced internally to a definite

digital value. This can be done either by using pull-up/down resistors or by configuring the

pins in output mode.

I/O dynamic current consumption

In addition to the internal peripheral current consumption measured previously (see

Table 50: Peripheral current consumption, the I/Os used by an application also contribute to

the current consumption. When an I/O pin switches, it uses the current from the I/O supply

voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load (internal or

external) connected to the pin:

ISW = VDD  fSW  C

where

 ISW is the current sunk by a switching I/O to charge/discharge the capacitive load

 VDD is the I/O supply voltage

 fSW is the I/O switching frequency

 C is the total capacitance seen by the I/O pin: C = CIO+ CEXT

 CIO is the I/O pin capacitance

 CEXT is the PCB board capacitance plus any connected external device pin

capacitance.

The test pin is configured in push-pull output mode and is toggled by software at a fixed

frequency.

114/193

DS11929 Rev 10

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