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ST72334J4B7(2003) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST72334J4B7 Datasheet PDF : 153 Pages
First Prev 121 122 123 124 125 126 127 128 129 130 Next Last
ST72334J/N, ST72314J/N, ST72124J
EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a &
5b) is implemented to completely absorb the posi-
tive ESD discharge.
Multisupply Configuration
When several types of ground (VSS, VSSA, ...) and
power supply (VDD, VDDA, ...) are available for any
reason (better noise immunity...), the structure
shown in Figure 81 is implemented to protect the
device against ESD.
Figure 79. Positive Stress on a True Open Drain Pad vs. VSS
VDD
VDD
Main path
Path to avoid
(1)
OUT
(4)
IN
(5a)
(3b)
(2b)
(5b)
VSS
Figure 80. Negative Stress on a True Open Drain Pad vs. VDD
VDD
Main path
OUT
(4)
IN
(3b)
(3b)
VSS
VDD
(1)
(2b)
(3b)
VSS
Figure 81. Multisupply Configuration
VDD
VSS
VDDA
VDDA
VSS
VSSA
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA
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