M69KB096AB
9 DC and AC parameters
Table 22. Synchronous Burst Write AC Characteristics
Symbol Alt.
Parameter(1)
104MHz
Min Max
80MHz
Unit
Min Max
tAVWL
tLLWL(2) tAS Address Set-up to Beginning of Write Operation
0
0
ns
tLHAX tAVH Latch Enable High to Address Transition (Fixed Latency) 2
2
ns
tEHEL(3)
tCBPH
Chip Enable High between Subsequent Operations in
Full-Synchronous or NOR-Flash mode.
5
6
ns
tELEH(3) tCEM Maximum Chip Enable Low Pulse
4
4 µs
tELTV
tLLTV
tCEW Chip Enable Low to WAIT Valid
1
7.5
1
7.5 ns
tELKH tCSP Chip Enable Low to Clock High
3
4
ns
tKHAX
tKHRL
tKHLH
tKHDX
tKHEH
tKHBH
tKHWH
tHD Hold Time From Active Clock Edge
2
2
ns
tKHLL
tKADV
Last Clock Rising Edge to Latch Enable Low (Fixed
Latency)
4
6
ns
tEHDZ
tEHTZ(4) tHZ Chip Enable High to Input Hi-Z or WAIT Hi-Z
8
8 ns
tKHTV
tKHTX
tKHTL Clock High to WAIT Valid or Low
7
9 ns
tAVKH
tDVKH
tWLKH
tLLKH
tBLKH
tWHKH
tWHWL
tSP Set-up Time to Active Clock Edge
3
3
ns
1. These timings have been obtained in the measurement conditions described in Table 14: Operating and AC Measurement
Conditions and Figure 13: AC Measurement Load Circuit.
2. tAVWL and tLLWL, are required if tELKH> 20ns.
3. A refresh opportunity must be offered every tELEH. A refresh opportunity is possible either if E is High during the rising edge
of K; or if E is High for longer than 15ns.
4. The Hi-Z timings measure a 100mV transition from either VOH or VOL to VCCQ/2.
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