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OR2T15B7BA352-DB 查看數據表(PDF) - Lattice Semiconductor

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OR2T15B7BA352-DB
Lattice
Lattice Semiconductor 
OR2T15B7BA352-DB Datasheet PDF : 200 Pages
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ORCA Series 2 FPGAs
Data Sheet
November 2006
Estimating Power Dissipation (continued)
Table 16. DC Power for 5 V Tolerant I/Os for
OR2TxxA devices
OR2T15A Clock Power
Device
PTOL (VDD5 = 5.25 V)
P = [0.34 mW/MHz
2T04A
1.7 mW
+ (0.17 mW/MHz – Branch) (# Branches)
+ (0.01 mW/MHz – PFU) (# PFUs)
+ (0.003 mW/MHz – SMEM_PFU)
(# SMEM_PFUs)] fCLK
S For a quick estimate, the worst-case (typical circuit)
OR2T15A clock power 5.9 mW/MHz.
E OR2T26A Clock Power
P = [0.35 mW/MHz
+ (0.19 mW/MHz – Branch) (# Branches)
IC + (0.01 mW/MHz – PFU) (# PFUs)
D + (0.003 mW/MHz – SMEM_PFU)
(# SMEM_PFUs)] fCLK
V For a quick estimate, the worst-case (typical circuit)
E OR2T26A clock power 8.3 mW/MHz.
E OR2T40A Clock Power
U P = [0.37 mW/MHz
+ (0.23 mW/MHz – Branch) (# Branches)
D IN + (0.01 mW/MHz – PFU) (# PFUs)
+ (0.003 mW/MHz – SMEM_PFU)
(# SMEM_PFUs)] fCLK
T T For a quick estimate, the worst-case (typical circuit)
OR2T40A clock power 12.4 mW/MHz.
C The power dissipated in a PIC is the sum of the power
N dissipated in the four I/Os in the PIC. This consists of
power dissipated by inputs and ac power dissipated by
E outputs. The power dissipated in each I/O depends on
O whether it is configured as an input, output, or input/
output. If an I/O is operating as an output, then there is
L a power dissipation component for PIN, as well as
E C POUT. This is because the output feeds back to the
input.
The power dissipated by an input buffer (VIH = VDD
S IS 0.3 V or higher) is estimated as:
PIN = 0.09 mW/MHz
D The 5 V tolerant input buffer feature dissipates addi-
2T08A
2T10A
2T15A
2T26A
2T40A
2.4 mW
2.7 mW
3.4 mW
4.0 mW
5.0 mW
The ac power dissipation from an output or bidirec-
tional is estimated by the following:
POUT = (CL + 8.8 pF) x VDD2 x F Watts
where the unit for CL is farads, and the unit for F is Hz.
As an example of estimating power dissipation,
suppose that a fully utilized OR2T15A has an average
of three outputs for each of the 400 PFUs, that all
20 clock branches are used, that 150 of the 400 PFUs
have FFs clocked at 40 MHz (16 of which are operating
in a synchronous memory mode), and that the PFU
outputs have an average activity factor of 20%.
Twenty inputs, 32 outputs driving 30 pF loads, and
16 bidirectional I/Os driving 50 pF loads are also gen-
erated from the 40 MHz clock with an average activity
factor of 20%. The worst-case (VDD = 3.6 V) power dis-
sipation is estimated as follows:
PPFU = 400 x 3 (0.08 mW/MHz x 20 MHz x 20%)
= 384 mW
PCLK
= [0.34 mW/MHz + (0.17 mW/MHz – Branch)
(20 Branches)
+ (0.01 mW/MHz – PFU) (150 PFUs)
+ (0.003 mW/MHz – SMEM_PFU)
(16 SMEM_PFUs)] [40 MHz]
= 212 mW
PIN = 20 x [0.09 mW/MHz x 20 MHz x 20%]
= 7 mW
PTOL = 3.4 mW
POUT = 30 x [(30 pF + 8.8 pF) x (3.6)2 x 20 MHz
x 20%]
tional dc power. The dc power, PTOL, is always dissi-
pated for the OR2TxxA, regardless of the number of
= 60 mW
5 V tolerant input buffers used when the VDD5 pins are PBID = 16 x [(50 pF + 8.8 pF) x (3.6)2 x 20 MHz
connected to a 5 V supply as shown in Table 16. This
x 20%]
power is not dissipated when the VDD5 pins are con-
nected to the 3.3 V supply.
= 49 mW
TOTAL = 0.72 W
66
Lattice Semiconductor

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