Data Sheet
November 2006
ORCA Series 2 FPGAs
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of
those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended periods
can adversely affect device reliability.
The ORCA Series FPGAs include circuitry designed to protect the chips from damaging substrate injection currents
and prevent accumulations of static charge. Nevertheless, conventional precautions should be observed during stor-
age, handling, and use to avoid exposure to excessive electrical stress.
S Parameter
Symbol
Min
Max
Unit
Storage Temperature
Tstg
–65
150
°C
E Supply Voltage with Respect to Ground
VDD
–0.5
7.0
V
VDD5 Supply Voltage with Respect to Ground VDD5
VDD
7.0
V
IC (OR2TxxA)
D Input Signal with Respect to Ground
—
–0.5
VDD + 0.3
V
OR2TxxA only
VDD5 + 0.3
Signal Applied to High-impedance Output
—
–0.5
VDD + 0.3
V
V E OR2TxxA only
VDD5 + 0.3
Maximum Soldering Temperature
—
—
260
°C
E U Recommended Operating Conditions
D IN OR2CxxA
OR2TxxA/OR2TxxB
T Mode
C T Commercial
N Industrial
Temperature
Range
(Ambient)
0 °C to 70 °C
–40 °C to +85 °C
Supply Voltage
(VDD)
5 V ± 5%
5 V ± 10%
Temperature
Range
(Ambient)
0 °C to 70 °C
–40 °C to +85 °C
Supply Voltage Supply Voltage*
(VDD)
(VDD5)
3.0 V to 3.6 V
3.0 V to 3.6 V
VDD to 5.25 V
VDD to 5.25 V
E Notes:
During powerup and powerdown sequencing, VDD is allowed to be at a higher voltage level than VDD5 for up to 100 ms.
O During powerup sequencing of OR2TxxA devices VDD should reach 1.0 V before voltage applied to VDD5 can be greater than the voltage applied
L to VDD.
The maximum recommended junction temperature (TJ) during operation is 125 °C.
SE DISC *VDD5 not used in OR2TxxB devices.
Lattice Semiconductor
131