Data Sheet
November 2006
ORCA Series 2 FPGAs
Timing Characteristics (continued)
Table 40A. OR2CxxA and OR2TxxA Synchronous Memory Read Characteristics (SSPM and SDPM Modes)
OR2CxxA Commercial: VDD = 5.0 V ± 5%, 0 °C ≤ TA ≤ 70 °C; OR2CxxA Industrial: VDD = 5.0 V ± 10%, –40 °C ≤ TA ≤ +85 °C.
OR2TxxA Commercial: VDD = 3.0 V to 3.6 V, 0 °C ≤ TA ≤ 70 °C; OR2TxxA Industrial: VDD = 3.0 V to 3.6 V, –40 °C ≤ TA ≤
+85 °C.
Parameter
S Read Operation (TJ = 85 °C, VDD = min):
Read Cycle Time
Data Valid After Address
E (A[3:0], B[3:0] to F[3:0])
Read Operation, Clocking Data Into
Latch/FF (TJ = 85 °C, VDD = min):
IC Address to Clock Setup Time
(A[3:0], B[3:0] to CK)
D Clock to PFU Output—Register
(CK to Q[3:0])
Symbol
Speed
-3
-4
-5
-6
-7
Unit
Min Max Min Max Min Max Min Max Min Max
TRC
3.6 — 2.7 — 2.4 — 2.3 — 2.0 — ns
MEMS*_ADEL — 2.8 — 2.1 — 1.7 — 1.4 — 1.1 ns
MEMS*_ASET 1.8 — 1.2 — 1.1 — 1.0 — 0.9 — ns
REG_DEL — 2.0 — 1.9 — 1.5 — 1.3 — 1.0 ns
V E Table 40B. OR2TxxB Synchronous Memory Read Characteristics (SSPM and SDPM Modes)
OR2TxxB Commercial: VDD = 3.0 V to 3.6 V, 0 °C ≤ TA ≤ 70 °C; OR2TxxB Industrial: VDD = 3.0 V to 3.6 V, –40 °C ≤ TA ≤
E U +85°C.
Speed
D Parameter
Symbol
-7
-8
Unit
IN Min
Max
Min
Max
Read Operation (TJ = 85 °C, VDD = min):
Read Cycle Time
TRC
1.9
—
1.8
—
ns
T Data Valid After Address
MEMS*_ADEL
—
1.8
—
1.4
ns
T (A[3:0], B[3:0] to F[3:0])
Read Operation, Clocking Data into
Latch/FF (TJ = 85 °C, VDD = Min):
C N Address to Clock Setup Time
MEMS*_ASET
0.9
—
0.8
—
ns
(A[3:0], B[3:0] to CK)
Clock to PFU Output—Register
REG_DEL
—
1.0
—
1.0
ns
E (CK to Q[3:0])
L O A[3:0], B[3:0]
E C F[3:0]
S DIS CK
MEM*_ADEL
MEM*_ASET
REG_DEL
Q[3:0]
5-4622(F).r2.a
Figure 61. Synchronous Memory Read Cycle
Lattice Semiconductor
149