T2080NXE8MQLB View Datasheet(PDF) - NXP Semiconductors.
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T2080NXE8MQLB Datasheet PDF : 186 Pages
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Hardware design considerations
4.4 SerDes block power supply decoupling recommendations
The SerDes block requires a clean, tightly regulated source of power (SnVDD and
XnVDD) to ensure low jitter on transmit and reliable recovery of data in the receiver. An
appropriate decoupling scheme is outlined below.
NOTE
Only SMT capacitors should be used to minimize inductance.
Connections from all capacitors to power and ground should be
done with multiple vias to further reduce inductance.
1. The board should have at least 1 x 0.1-uF SMT ceramic chip capacitor placed as
close as possible to each supply ball of the device. Where the board has blind vias,
these capacitors should be placed directly below the chip supply and ground
connections. Where the board does not have blind vias, these capacitors should be
placed in a ring around the device as close to the supply and ground connections as
possible.
2. Between the device and any SerDes voltage regulator there should be a lower bulk
capacitor for example a 10-uF, low ESR SMT tantalum or ceramic and a higher bulk
capacitor for example a 100uF - 300-uF low ESR SMT tantalum or ceramic
capacitor.
4.5 Connection recommendations
The following is a list of connection recommendations:
• To ensure reliable operation, it is highly recommended to connect unused inputs to
an appropriate signal level. Unless otherwise noted in this document, all unused
active low inputs should be tied to VDD, OVDD, DVDD, G1VDD, and LVDD as
required. All unused active high inputs should be connected to GND. All NC (no-
connect) signals must remain unconnected. Power and ground connections must be
made to all external VDD, OVDD, DVDD, G1VDD, LVDD and GND pins of the device.
• The TEST_SEL_B pin must be pulled high.
• The chip has temperature diodes on the microprocessor that can be used in
conjunction with other system temperature monitoring devices (such as on
Semiconductor, NCT72). Even if a temperature diode monitoring device is not
utilized on production systems, being able to access these pins for debug or problem
analysis can be valuable. Therefore, it is suggested to connect these pins to test points
connected to ground through low value resistors, which can be removed if a
temperature monitoring device is ever to be connected. The chip temperature diode
specifications are as follows:
QorIQ T2080 Data Sheet, Rev. 3, 03/2018
164
NXP Semiconductors
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